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| LD-001 Series LED displays Flat displays LD-001 Series The LD-001 series were designed in response to the need for medium-sized, flat displays. These are two-chip, flat displays with high luminance. !External dimensions (Units : mm) 10.7 +0 -0.1 9.50.1 4.50.1 +0 5.7 -0.1 2 0.6 5.00.5 !Features 1) 4.5 x 9.5 mm planar emission from two chips connected in series. 2) High luminance, uniform emission. 3) Four colors : red, orange, yellow and green. Cathode mark Max.0.8 Pin No.1 2 3 (2.5) (2.5) 0.6 5.60.1 Pin No.1 2 Tolerances are 0.3 unless otherwise noted: !Selection guide Emitting color Type Order-based production. Red LD-001VR Orange LD-001DU Yellow LD-001YY Green LD-001MG !Absolute maximum ratings (Ta = 25C) Parameter Power dissipation Forward current Peak forward current Reverse voltage Operating temperature Storage temperature Symbol PD IF IFP VR Topr Tstg Red LD-001VR Orange LD-001DU Yellow LD-001YY 120 20 60 3 120 20 60 3 -25~+75 -30~+85 120 20 60 3 Green LD-001MG 150 25 60 3 Unit mW mA mA V C C Pulse width 1ms duty 1 / 5 0.3 3 (1.8) R4 LD-001 Series LED displays !Electrical and optical characteristics (Ta = 25C) Parameter Forward voltage Reverse current Peak wavelength Spectral line half width Symbol Conditions VF IR P IF = 10mA VR = 3V IF = 10mA IF = 10mA Red - - - - - - - - Orange - - - - Yellow - - - - Green Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.0 - 650 40 2.8 10 - - 2.0 - 610 40 2.8 10 - - 2.1 - 585 40 2.8 10 - - 2.1 - 563 40 2.8 10 - - Unit V A nm nm Electrical and optical values are guaranteed values per element. !Luminous intensity vs. wavelength 1.0 Axial Luminous Intensity 0.8 0.6 0.4 0.2 0 500 Green Yellow Orange Red 550 600 650 700 750 Wavelength : P (nm) !Luminous intensity Color Red Orange Yellow Green Type LD-001VR LD-001DU LD-001YY LD-001MG Min. 2.2 2.2 1.4 3.6 Typ. 6.3 6.3 4.0 10 Max. - - - - Unit mcd mcd mcd mcd Note 1: Measured at IF = 10mA Note 2: Current passes through 2 elements in series. !Operation notes When forming leads, the bend should be at least 2mm from the base of the package. Solder after forming the leads, and ensure that the inside of the LED is not subjected to mechanical stress while it is hot. |
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